![]() ![]() Thermal profiling is the act of measuring several points on a circuit board to determine the thermal excursion it takes through the soldering process. Thermal Profiling: After pick and place but before reflow soldering, we need to find the optimal thermal profile (or reflow soldering profile).Then with all the components in place they can be moved to the reflow soldering oven. It is possible for the components to be glued to the board, but this makes rework very difficult. This is quite sufficient for normal handling, although some care is obviously needed. The pick and place machine places the SMD components onto the board, and they are held in place by the surface tension of the solder paste. ![]() ![]() Normally, an automatic pick and place machine is used because the numbers of components used nowadays, the accuracy and turnaround required make manual placement non-viable.
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